WEICON Silicone N 310 ml
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WEICON Silicone N 310 ml is a single-component, silicone-based elastic sealing and bonding material that vulcanizes at room temperature (RTV). Thanks to its neutral-curing structure, it aims to minimize the risk of corrosion and supports safe use on many metal surfaces. Its solvent-free formulation is suitable for applications that require a long-lasting, elastic seal with high resistance to external influences, functioning as an industrial adhesive and gap-filling solution. WEICON Silicone N is developed by the Germany-based manufacturer WEICON GmbH & Co. KG.
Elastic Sealing and Bonding with WEICON Silicone N
Silicone N is designed to create a permanently elastic bead that can tolerate movement, especially in joints, cover-to-housing connections, and vibration-exposed areas. With its neutral curing mechanism (oxime system), it is intended to provide adhesion performance on surfaces such as metal, glass, and ceramics, and it can be used as an industrial adhesive in general maintenance and repair work. As it is formulated to resist weathering and aging effects, it can be preferred for both indoor and outdoor sealing applications. It also features a structure intended to help protect against mold growth with a fungicide additive; however, it should be noted that sensitive users may experience allergic reactions.
Technical Features and Resistance Values
The chemical base of WEICON Silicone N is a 1K polysiloxane (oxime) and it comes in a cartridge as a paste-like material. Its temperature resistance is typically specified in the range of -50 °C to +180 °C, enabling flexible use around equipment exposed to temperature fluctuations. An elongation at break of approximately 550% supports the ability to accommodate joint movement and provides an advantage for long-term sealing. Since the material is described as having low sag/slump behavior, controlled application on vertical joints is targeted. For installations requiring electrical insulation, the dielectric strength is typically stated as 17 kV/mm, making it suitable for certain insulation-related uses as a combination of industrial adhesive and sealant.
Application Conditions and Curing Behavior
Before application, surfaces are expected to be dry, clean, and free from oil, as dirt and release agents can significantly reduce adhesion. The processing temperature range is given as +5 °C to +35 °C, so maintaining surface and ambient conditions within this range is important, especially in cold environments. Since the product cures with moisture, relative humidity and temperature directly affect curing speed; typical cure progression is stated as 2–3 mm within the first 24 hours. As the initial skin formation time is approximately 7 minutes, joining and tooling of parts or joints should be completed within this window. Controlled dispensing can be achieved using a cartridge gun and suitable nozzles, while joint geometry and fill depth should be planned according to the desired performance.
Surface Compatibility, Industry Uses, and Standards
While Silicone N is intended to provide good adhesion on metals, glass, and ceramics, it can also be used for sealing on many other materials; for critical plastics, surface compatibility should be verified with a trial application. It is used in plastic processing technologies, electrical and energy technologies, lighting equipment assembly, and control cabinet/enclosure sealing to limit moisture, dust, and environmental effects. In exhibition-stand, showcase, and retail applications, it is expected to provide a permanently elastic solution for joint filling and vibration-exposed connections. The fungicide additive can help reduce mold risk in humid environments; however, due to biocidal content, sensitive users should pay attention to contact and ventilation conditions. The product is stated to be classified as B2 according to DIN 4102 within the building material category, which can support suitability assessments in projects with standard requirements. Overall, these properties make WEICON Silicone N a reliable industrial adhesive alternative for many maintenance and assembly scenarios where both sealing and bonding are required.






