Adhetron EP5087 Thermally Conductive Adhesive 50 ml

Adhetron EP 5087 Thermally Conductive Adhesive 50 ml

Adhetron EP 5087 is a two-component, epoxy-based industrial adhesive developed for electronic assemblies requiring heat transfer. According to the official technical datasheet, the product is a thermally conductive system that can be used as an adhesive, sealant, and potting compound. Its design for bonding metal, plastic, ceramic, and ferrite surfaces makes it functional in various technical assembly scenarios. The country of origin is not separately specified in the technical document; the product is offered by Pulsar Chem. Industry and Trade Co. INC. under the Adhetron brand.

EP 5087 Technical Structure and Performance Features

This industrial adhesive is a gray epoxy system with a paste-like consistency after mixing. In the official TDS, the mixed viscosity is stated as 35,000 cPs, the specific gravity as 2.35, and the mixing ratio as 1:1 by weight or volume. Its thermal conductivity value is given as 1.5 W/mK, while Shore D 75 hardness, 25% elongation at break, and 1600 psi lap shear strength show that the product offers a balanced profile in terms of both heat transfer and mechanical bonding. Since its temperature resistance is stated as -40°C to +150°C, this industrial adhesive represents a technical solution suitable for electronic systems under thermal load.

EP 5087 Application Areas and Surface Compatibility

According to the official product description, EP 5087 was developed to dissipate heat in electronic applications. For this reason, the product can be used in the assembly of heat-generating electronic components, in potting and sealing operations, and in the bonding of metal, plastic, ceramic, and ferrite parts. Electronics manufacturing, electromechanical assembly, and technical equipment applications requiring thermal management are among its most suitable areas of use. It offers a more meaningful solution especially in systems where both bonding and thermal conductivity are required together.

Application Method and Process Control

Before application, the surfaces must be completely free of dust, oil, and other contaminants. After components A and B are mixed in a 1:1 ratio, the official document states that the product has an approximate working time of 10 minutes and a gel time of 60 minutes at 25°C. Full cure takes place within 24 hours at room temperature, while an accelerated cure option of 60 minutes at 65°C is also provided. This structure makes the product a practical industrial adhesive for applications requiring controlled mixing and time management in the process.

Electrical Properties, Storage, and Technical Notes

The inclusion of electrical performance data such as volume resistivity and dielectric constant shows that the product can be considered not only for bonding but also for applications with certain insulation requirements. Since no independent certification or specific industry standard is additionally stated in the official technical datasheet, technical evaluation should be made directly on the basis of the manufacturer’s TDS data. It is stated that the product can be stored for 12 months at room temperature in its original unopened packaging. As a technical note, the official document states that the resin in component B may crystallize during storage, but this is a reversible condition that can be restored by heating at 60°C for 1 hour.