Adhetron EL-Tech 230He Silver-Filled Epoxy Two-Component Adhesive

EL-Tech 230He, with its silver-filled, epoxy-based two-component structure that provides electrical conductivity, belongs to a class of heat-curing industrial adhesives. It is positioned for joining both electronic and mechanical attachments in electronic devices, with a particular focus on conductive interconnection needs in microelectronics and optoelectronics applications. Thanks to its 100% solids formulation, it aims to create a joint without solvent-related volume loss. This industrial adhesive is described as being used with controlled mixing and curing parameters in the production process.

EL-Tech 230He industrial adhesive definition and structure

This product is defined as a two-component epoxy industrial adhesive filled with silver to provide electrical conductivity. A 1:1 mix ratio by weight makes it easier to establish a process compatible with standard dispensing and weighing procedures in production. The fact that both components are silver-colored and “paste-like” supports practical use in assembly points that require flow control and localized application. The technical document particularly emphasizes strong solvent resistance, which is an important parameter for scenarios where the bond line may come into contact with cleaning agents and process chemicals during electronics assembly cycles. On the manufacturer side, the Adhetron brand is stated under Pulsar Kimya; it is also indicated that the R&D center is in Connecticut/USA and the distribution center is in Turkey.

EL-Tech 230He performance and durability characteristics

On the electrical side, volume resistivity is given in the 0.0001–0.0004 Ω·cm range; this is a key reference for design validation in conductive adhesive joints. Thermal conductivity is listed as 6.5 W/mK and may provide an additional advantage in some electronic modules where thermal management is expected. The glass transition temperature (Tg) is specified as 115°C, which helps with mechanical stability assessment in assemblies exposed to thermal cycling. Mechanically, tensile-lap shear strength is shared at 10.5 N/mm², indicating the joint is intended to meet not only conductivity but also structural retention expectations. Temperature resistance is given as -55 to +200°C; this range can be used for suitability checks in low-temperature storage and mid-to-high operating temperature scenarios. For this industrial adhesive, density (specific gravity) is listed as 2.6 and should be considered in consumption calculations.

Industry use cases and advantages of 230He

Since the product is designed for joining electronic and mechanical attachments in electronic devices, electronics production and assembly lines are the primary areas of use. In microelectronics, securing small-scale components such as chips stands out, while in optoelectronics, module assemblies requiring conductive connections are prominent. Its potential use at points on electrical/electronic boards that require conductive bonding can provide process flexibility in certain designs seeking an alternative to thermal processes such as soldering. The ability to cure quickly with heat is a practical advantage for operations that want to manage cycle time in mass production. The paste consistency helps reduce run-off risk on vertical surfaces or localized application points, supporting more controlled application. The emphasis on solvent resistance can help maintain performance continuity during post-assembly cleaning steps or in environments where process chemicals are present. In this context, 230He offers a technically balanced industrial adhesive approach for applications requiring both conductivity and mechanical bonding.

Mixing, application, and curing process management

Before application, it is recommended to homogenize components A and B in their own containers, then add component B to component A and mix until the blend is uniform. Since the mix ratio is specified as 1:1 by weight, running the process on a weighing basis is important for consistency. With a pot life stated as 4 days at 21°C, post-mix waiting time and production planning should be structured around this window. Curing options are provided such as 90 minutes at 80°C, 15 minutes at 120°C, 5 minutes at 150°C, or 45 seconds at 175°C; an appropriate cure profile can be selected based on the targeted cycle time and part durability requirements. A shelf life of 12 months at 25°C in unopened, unmixed packaging sets a clear limit for inventory management and lot planning. Since the manufacturer document recommends application-specific validation trials, it is expected that process parameters will be confirmed through sample runs before mass production.

Practical notes for surface and system compatibility

Because the technical description states that the product is designed for bonding attachments in electronic devices, its use scenario is largely shaped around electronic assembly surfaces and conductive contact regions. Since chips and electrical/electronic boards are listed as application areas by the manufacturer, it is considered for PCB assemblies and similar subsystems where conductive connections are needed. The paste-like consistency can support contact continuity in small tolerance gaps that require gap filling, helping create a more stable joint geometry. In conductive epoxy systems of this type, dispensing volume and cure profile directly affect electrical continuity and mechanical retention; therefore, maintaining process discipline is considered critical. Since the technical document does not list a specific certification or standard claim for the product, for regulation-sensitive applications it is appropriate to proceed with internal validation tests along with the required safety documentation. Overall, when applied under controlled processes, 230He is positioned as a reliable industrial adhesive solution for heat-cured conductive interconnection requirements.