Adhetron UV-Sil 3022 Dual-Curing Circuit Coating Compound 1000 g

SKU: ADH-UVSIL3022
In Stock

A dual-curing electronic circuit coating compound is used for coating, filling, and protection applications on circuits, pins, and sensitive components. Thanks to its structure that can cure by both UV and moisture, it provides reliable protection and a flexible coating even in shadowed areas.

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Certified industrial adhesive solutions from leading global brands.

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Product Variety

Epoxy, polyurethane, silicone, anaerobic, and many more.

Adhetron UV-Sil 3022 is a dual-curing, silicone-based coating compound developed for the potting, encapsulation, and coating of electronic parts. With its one-component and non-corrosive structure, the product cures by UV light or atmospheric moisture to form a very soft elastomer layer. This structure provides a functional solution in electronic protection applications, since moisture curing ensures process reliability even in areas where light cannot reach. Adhetron is a brand of Pulsar Chem. Industry and Trade Co. INC.; according to official corporate information, the brand’s R&D and production structure is associated with Connecticut, USA, Great Britain, and Japan, while global distribution is carried out through Türkiye.

UV-SIL 3022 Technical Structure and Curing Properties

This product belongs to the dual-curing RTV silicone rubber class with a neutral cure oxime mechanism. Official technical data state that it can be cured with UV-A, 365 nm UV LED, and moisture; in addition, a UV curing value of 120 seconds at 2 mm layer thickness under a light intensity of 40 mW/cm² is provided. Since its viscosity is given in the range of 4000–5000 cP, it offers more balanced spreading in electronic applications requiring flow control. Its one-component structure eliminates mixing errors and helps establish a simpler application process.

UV-Sil 3022 Performance and Resistance Profile

In its cured state, the product has a Shore A hardness of 15, which indicates that it forms a flexible and shock-absorbing layer rather than a rigid coating. The technical datasheet states an operating temperature range of -40°C to +200°C, a water absorption value of <0.1% after 3 days, and a shrinkage value of <0.5% after 72 hours at 60°C. On the electrical side, the values of 4.53 x 10^13 ohm-cm volume resistivity, 3.35 dielectric constant, and 424 V/mil dielectric strength show that the product has a character suitable for electronic circuit protection applications. The official document also includes UL 746E listing information, which indicates that the product can be referenced for certain electrical application expectations.

Application Method and Compatible Systems

The product is applied on electronic parts and pins for coating, sealing, encapsulation, and filling purposes. During application, ensuring that the surface is clean and that the appropriate layer thickness is selected directly affects both UV curing efficiency and the integrity of the final coating. Rapid UV curing is achieved in exposed areas, while atmospheric moisture allows curing to continue in shadowed areas. This structure provides an operational advantage especially in complex-geometry electronic components, around connectors, and in circuit areas where partial shadowing occurs.

Industrial Use Areas and Key Advantages

This coating compound can be used in electronics manufacturing, lighting equipment, industrial control components, and pin protection applications. In boards, modules, and sensitive electronic subcomponents requiring potting and encapsulation, one of its key advantages is its ability to form a flexible protective layer against moisture, environmental effects, and mechanical stress. Thanks to its high temperature resistance, low water absorption tendency, and dual-curing structure, it offers a balanced usage profile between mass production and maintenance-oriented applications. Its ability to be stored for up to 12 months at 4°C or below in unopened packaging also provides practicality in stock and process planning.

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