Adhetron EL-Tech 235 Silver-Filled Two-Component Adhesive

Adhetron EL-Tech 235 is an epoxy-based industrial adhesive that provides electrical conductivity thanks to its silver-filled, two-component structure and cures at room temperature. It is positioned especially for combining electrical and mechanical joints in electronic devices, and for applications that require a “cold cure” approach on heat-sensitive components. Its 100% solids (solvent-free) formulation aims to meet gap-filling and conductive interconnection requirements at the same time. The product is described as delivering repeatable performance when used under controlled mixing and curing conditions in technical processes.

Structure and product description of EL-Tech 235

This two-component system is defined as an electrically conductive industrial adhesive containing silver filler in an epoxy-based matrix. Components A and B are silver-colored, and the “paste-like” consistency provides an advantage in dispensing and in-place applications by helping control flow and run-off. A 1:1 mix ratio by weight supports weight-based processes in both production and field applications. The manufacturer’s documents emphasize resistance to solvents and chemicals, which is important for scenarios where the bond line may contact cleaning agents and process chemicals during electronics assembly cycles. The Adhetron brand is offered under Pulsar Chem (Pulsar Kimya); the brand’s R&D center is stated as Connecticut/USA, and the distribution center as Turkey.

Mixing, application method, and cure management

Before application, it is recommended to homogenize components A and B in their own containers, then add B into A and mix until the blend is uniform. With a pot life of 90 minutes, the post-mix application window must be planned and unnecessary waiting should be avoided. A room-temperature cure of 24 hours at 25°C provides process convenience for assemblies where oven curing is not possible or components are temperature-sensitive. If needed, accelerated cure alternatives are listed in the document, such as 60 minutes at 65°C, 30 minutes at 95°C, or 5 minutes at 120°C. The stated shelf life of 12 months at 25°C in unopened, unmixed packaging provides a practical reference for inventory management and lot tracking. In industrial adhesive applications of this type, it should be considered critical to validate process parameters through trial applications as recommended by the manufacturer.

Summary of electrical and thermal performance

The product’s volume resistivity is specified from 0.005 Ω·cm at 25°C down to 0.0002 Ω·cm at 120°C; this range indicates that the temperature effect should be monitored in assemblies targeting conductive connections. With thermal conductivity stated as 7.8 W/mK, it may also be evaluated in certain electronic designs where not only electrical but also thermal conduction is desired. Mechanically, tensile-lap shear strength is listed as 8.5 N/mm², indicating the goal is to meet not only “conductivity” but also “bond strength” requirements. The specific gravity is given as 3.2, reflecting the density impact of the silver filler and should be considered when estimating consumption based on dispensed volume. Since the service temperature range is shared as -50 to +175°C, suitability for electronic subassemblies exposed to thermal cycling should be assessed within this band.

Surface compatibility and design notes

The manufacturer’s description states that the product is designed for bonding electronic and mechanical attachments in electronic devices; therefore, conductive contact surfaces and mounting points are typical target areas. The emphasis on gap-filling properties is intended to support continuity of contact in joints with tolerance-related clearances. The “room-temperature cure” approach suitable for heat-sensitive applications provides an alternative joining method in cases where thermal processes such as soldering may be risky. Since specific substrate lists can vary by application, it is expected that small-scale sample trials should be conducted to verify adhesion and conductivity for critical parts.

Industry use cases and key advantages

This product belongs to an industrial adhesive class preferred in electrical/electronics production and assembly lines where heat-sensitive components need to be bonded. The need to create conductive paths in areas such as RF applications and EMI shielding highlights the value of a silver-filled conductive epoxy approach. The chemical resistance emphasis provides a safety margin for applications involving post-production cleaning steps, field conditions, or potential contact with process chemicals. The manufacturer’s page states that the safety data sheet (MSDS/SDS) will be shared by email upon request; therefore, organizations with EHS requirements should plan SDS acquisition during procurement. Since the technical document does not list an additional certification/standard claim for the product, it is the right approach to proceed with verification tests in line with internal procedures for regulation-critical applications. With the correct mix ratio, controlled cure, and process trials, it offers a balanced solution for electronic assemblies requiring both conductivity and mechanical bonding.