Adhetron EL-Tech 255Si HV Al-Ag Silicone-Based Two-Component Adhesive

Adhetron EL-Tech 255Si Hv is a two-component, silicone-based product used for both bonding and sealing in assemblies that require electrical conductivity. With its silver-coated aluminum and silver blend filler, it focuses on applications where EMI/RF shielding and grounding continuity are targeted. Its solvent-free, high-viscosity, non-sag paste form helps simplify fillet filling and seam sealing operations in electrical cabinets and enclosures. With these features, it is positioned as an industrial adhesive solution in the conductive filler category.

Definition of the EL-Tech 255Si HV Conductive Silicone-Based Industrial Adhesive

The product is defined as a flexible, silicone-based industrial adhesive and sealing material with a two-component system. Its main purpose is to create a conductive path for EMI shielding or electrical grounding while filling/sealing seams and joints in electrical enclosures. A cure system that can proceed at room temperature or with heat allows application planning according to different process needs. The ability to apply without a primer and the approach intended to support galvanic corrosion resistance on aluminum surfaces provide important practicality in field applications. Manufacturer/origin in one sentence: Adhetron is a brand of Pulsar Kimya Sanayi ve Ticaret A.Ş.

Technical Structure, Performance, and Durability Parameters

In this conductive silicone system, the base material is stated as silicone and the mix ratio is 1:1 by both weight and volume. Since the pot life (usable time) is given as 45 minutes, the operating window can be clearly planned, especially in jobs carried out with dispensing and application equipment. The cured product hardness is specified as Shore A 40, which helps maintain a certain flexibility in the bond line while sustaining the sealing function. The operating temperature range is given as -65 °C to 200 °C, making it suitable for enclosure and chassis applications exposed to thermal cycling.

Electrical Conductivity and Thermal Properties

The product’s volume resistivity is reported as 0.028 Ω·cm, a key selection criterion for designs requiring EMI shielding and grounding continuity. Thermal conductivity is specified as 2 W/mK, supporting a predictable performance approach for heat transfer in conductive filler applications. Since shrinkage is given as below 1%, it provides an advantage aimed at reducing the risk of void formation along the joint line after cure. Weight loss after 1 week at 150 °C is stated as 0.25%, which serves as a technical reference for applications requiring stability at elevated temperatures.

Application Method, Compatible Substrates, and Use Notes

As a high-viscosity, non-sag paste-form industrial adhesive, the product enables controlled shaping in fillet filling and seam sealant applications. It is stated to bond to metals, plastics, composites, silicones, and even gold/gold-plated surfaces; this broad compatibility provides process flexibility for multi-material enclosure designs. Before application, cleaning surfaces from oil, dirt, and weak coating residues should be considered critical for both sealing and maintaining conductivity continuity. It is stated that the material is supplied in separate packs and can be applied using pressure/time or positive-displacement dispensing equipment, supporting repeatability in production and maintenance lines. Since a shelf life of 9 months at 23 °C in the original unopened package is specified, batch tracking is important in inventory management.

Sector-Based Applications and Key Advantages

This product is positioned for applications such as EMI/RF shielding in electrical cabinets and electronic enclosures, forming conductive gaskets, repairing existing EMI gaskets, and bonding silicone-based EMI gaskets. It finds preferred use in environments where vibration and environmental stresses can occur, such as portable electronics, radar and communication systems, EMI vents, military ground vehicles, and shelters. A primerless application approach contributes to assembly continuity by reducing process steps. The flexible bond line is designed to help damp the strain of rigid EMI gaskets and manage stress accumulation at the joint area. Since the technical documents do not state a specific certification/standard claim, suitability for standards-driven projects should be clarified through internal testing and verification procedures.